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SoC10 Agenda	SoC10 Abstract & Bios	SoC10 Exhibiting Companies	SoC10 Keynotes	SoC10 Job Fair
SoC10 Student Design Contest		Main		Workshops

Keynote Speakers

 

	Altera Dr. Mike Peng Li, Fellow, Altera Corporation.  "FPGAs and the Era of Silicon Convergence."	HP Dr.  Janice Nickel, Cognitive Systems Laboratory at Hewlett Packard Laboratories.   “Making Memristors a Reality: Advances in Physical Understanding and Device Integration.”	Microsemi Jim Aralis, Chief Technology Officer (CTO), and Vice President of R&D. “A New Paradigm: Disruptive SoC Design & Market Strategies.”	JPL Dr. Reza Ghaffarian,  Jet Propulsion Laboratory, California Institute of Technology. "FPGA Packaging Trend and System Approach for Reliability."	UCI Dr. Payam Heydari, Nanoscale Communication Integrated Circuits (NCIC) Labs, University of California Irvine. “Terahertz and Millimeter-Wave Imaging: New Frontiers of Electronics."

Platinum Sponsors

Gold Sponsors

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Selected Participating Companies, Universities & Organizations

		JRI Technology

 

Call for Sponsors and Panelists a Panelist Opportunities: No Abstract or Presentation Is Required –Please Submit Full Title, Bio and Picture for Technical Advisory Board (TAB) Review and Consideration to: SoC@SoCconference.com   The 10th International SoC Conference Panels: 1. Emerging Technologies, Trends, and Possibilities in Designing Multicore Smart SoC Platforms. 2. 3-D ICs . . . Technologies, Trends, Possibilities, and Challenges. 3. Entrepreneurship & Technology: Dreams, Realities & Opportunities.   For more information or questions, please contact SoC Organizing Committee:  SoC@SoCconference.com

 

SoC Conference Tracks   1. Emerging Technologies, Trends, and Possibilities in Designing Multicore Smart SoC Platforms. 2. Analog and Mixed-Signal & SOI Design Trends and Challenges for Embedded Smart SoC Platforms. 3. Packaging Technologies, Trends & Challenges. 4. Emerging Memories: Technologies, Trends & Challenges.  5. FPGAs & SoCs: Trends, Security, Reliability & Verification in Designing Complex SoC Platforms. * * * * * * * * * * * *

 

SOC   Conference   Technical   Scope

Multimillion-transistor System-on-Chip (SoC) devices, comprising several CPUs & DSPs, analog, optical, digital, and Micro-Electro-Mechanical Systems (MEMS), are integral parts of everyday communication, entertainment, medical, digital consumer, automotive, and military products. Over the past 9 years, the International SoC Conference has established itself as the premier annual event for System-on-Chip and VLSI. The Conference provides an outstanding platform for sharing and disseminating groundbreaking research, revolutionary product announcements, and innovative technical tutorials, and it has established itself as the forum for debating emerging challenges in System-on-Chip, VLSI, and Nanotechnologies. The 10th International SoC Conference, Exhibit & Workshops will be held at the Hilton Irvine (California) and will offer two days of technical presentations, panel discussions, tabletop exhibits, tutorials, and a variety of technical workshops.

 

	The International System-on-Chip (SoC) Conference, the premier event devoted to Chip Design and Development. . . The SoC Conference Organizing Committee & Technical Advisory Board are seeking submissions on all aspects of Chip Design & Development including:
	Semiconductor Technology 3D-IC Design & Packaging Analog, Mixed-Signal & RF Circuits and Systems SOI vs. CMOS for Analog & Digital Circuits CPU/DSP/GPU Cores High-Performance IO Sub-Systems & Interconnects Foundry Services & Technologies Novel CMOS Design Techniques EDA Tools, Algorithms, and Tool Usage Design Methodologies, Techniques, and Technologies for All Aspects of Electronic Circuits FPGA-Based Designs, Tools, and Applications Wireline and Wireless Communication Circuits and Systems Green Circuits, Systems, and Design Methodologies Embedded Memory Technologies & IPs Logic Synthesis and Circuit Optimization Timing and Circuit Analysis and Circuit Optimization Emerging Specialized Design Technologies Manufacturing Test and Silicon Debug System Level Design Methodology, EDA and Design Tools for SoC Signal Integrity, Design for Testability, and Design Verification Design for Manufacturability, Variation-Aware Methodologies	IC & IP Design SiP and Innovative Packing Techniques Network-on-Chip (NoC) & System-Level Communication & Interconnects Circuit Simulation and Interconnect Analysis Timing Analysis and Design for Manufacturability Physical Design and Manufacturability Power Analysis and Low-Power Design Validation, Test Planning, Testing and Coverage Formal Verification Signal Integrity and Design Reliability System-Level Design and Co-Design High-Level Synthesis Physical Synthesis Tools and Techniques Low-Power SoC Platforms Cost-Effective SoC-Based Platform Solutions Embedded Software, Tools and Design Embedded Design and Platforms Floor-Planning Beyond Die-Integration and Package/Hybrid/Board Design Novel Software Architecture for Multicore SoCs

In addition to conventional SoC-related topics, the SoC Conference invites proposals for topics for individual Tracks, Panels, Workshops and Tutorials.
 

SoC Conference Sponsorship opportunities	The SoC Conference provides a series of unique sponsorship opportunities for participating companies interested in promoting their names, logos, and brands and their products and technologies to a very targeted and interested audience To receive a complete listing of all available sponsorship opportunities, please contact SoC@SoCconference.com or call us at 949-851-1714. We will be more than happy to customize our sponsorship packages to meet your budget and your marketing objectives. SoC Conference Platinum and Gold sponsors’ logos will be displayed on the SoC Conference main page as well as on the Savant Company Web page until two weeks after the Conference. Sponsors’ logos are always displayed on the SoC Conference public archives page. Our Platinum and Gold sponsorship packages include Tabletop Exhibit opportunities, several complimentary Conference passes, and a variety of promotional opportunities. For specific sponsorship details, please contact SoC@SoCconference.com
SoC Conference Tabletop   Exhibit	The SoC Conference Tabletop Exhibit is an outstanding, inexpensive forum for your Sales, Marketing, and Applications Engineering teams, allowing them to meet face-to-face with design engineers attending the Conference or visiting the Tabletop Exhibit.   To reserve your Tabletop Exhibit space please contact SoC@SoCconference.com.  SoC Conference Tabletop Exhibit provides several free full conference passes as well as a series of outstanding promotional opportunities for the exhibiting companies. Please contact us for more information and to receive the Tabletop Exhibit application/contract.
SoC Conference Speaking opportunities	Track and Session Presenters, Keynote Speakers, and Panel Members who can contribute their professional expertise have a wonderful opportunity to share their innovative SoC, ASIC, ASSP, FPGA, and Foundry-related technology or products at this event to a very focused and targeted audience. Technical presentations are invited that address new and previously unpublished results on System-on-Chip topics and related areas such as Analog, Mixed-Signal, RF Circuits and Systems, SoC, ASIC, ASSP, FPGA, EDA, IP, Foundry Services, 3D-ICs, SOI, CMOS, Embedded Memory, Embedded Systems, NoC, IOs, IPs, CPU/DSP/GPU Cores, Signal Integrity, Design for Testability, Design Verification, Design for Manufacturability, Variation-Aware Methodologies, and more.   To explore speaking opportunities at the 9th International SoC Conference, for information on our Tabletop Exhibit, or to develop highly targeted Workshops, please contact the SoC Conference Organizing Committee at:   SoC@SavantCompany.com     or    SoC@SoCconference.com   or    (949) 851-1714
AUTHOR INFORMATION AND FORMAT	Presentations at the International System-on-Chip (SoC) Conference are in the form of 30-minute talks with PowerPoint slides. Presentation slides will be published in the SoC Conference Proceedings. Participants are not required to submit written papers, but a select group will be invited to submit a paper for inclusion in the SoC Conference Proceedings. Submissions must include a title, an extended abstract (two pages maximum), and the presenter's contact information (name, affiliation, job title, bio, address, phone, fax, and email). Please indicate whether you have submitted, intend to submit, or have already presented or published a similar or overlapping submission to another conference or journal. Also indicate if you would like the submission to be held confidential. Submissions are evaluated by the SoC Conference Organizing Committee and the SoC Technical Advisory Board on the basis of the overall complexity of the technology or device, the degree of innovation, the incorporation of advanced technology, the potential market significance, and most importantly, the anticipated interest to the audience. Research and software proposals will be evaluated by similar criteria. If you are describing a product, you must indicate its status: its design, development, tape out, silicon, shipping, etc. Please submit your extended abstract in plain ASCII or PDF to: SoC@SoCconference.com   or   SoC@SavantCompany.com  ASAP.   Submissions containing figures may be submitted in .pdf, but plain ASCII text or MS Word is preferred.
Don't Miss Out!	Please submit your proposed Abstract & Bio ASAP for SoC Conference Organizing Committee & Technical Advisory Board Review and Consideration.
Questions	SoC@SoCconference.com    or   949-851-1714
Attendee  demographics	Attendee demographics for past SoC Conferences (based on job responsibilities): 76% SoC & ASIC Designers, Design Engineers, System Architects, and Engineering Management 10% University Engineering Professors and Engineering Students 9% Technical Marketing, Sales, or Business Development Management 3% Strategic Planning, Media, Analysts 2% Other

 

Selected   Technology   &   Media   Sponsors

JRI Technology

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