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Call for Speakers a The SoC Conference Technical Advisory Board and Organizing Committee are seeking submissions on all aspects of IC & IP Design and Development, Semiconductor Technology, AI Chips, Machine Learning solutions, Mixed-Signal design, FPGA Solutions, eFPGA, ASSP, ASIC, Analog Design Techniques, High-Speed Interfaces and Challenges, CPU/DSP/MCU Cores, RISC-V, GPUs, NPUs, Leading-Edge IPs, Network-on-Chip (NoC), Leading 3 nm Foundries and Designs, Sub 10 nm Design Challenges, SOI Possibilities, Understanding FinFETs, IP Design and Development, IP Reusability, Design for Testing (DFT), Design for Manufacturing (DFM), Chip Design and Verification, 3D-Packaging, Low-Power Design Techniques, EDA Tools and Solutions for complex SoC Platforms, EDA Tools for Analog and Mixed-Signal Designs, New Design Methodologies and Approaches, Technology and Business Challenges, and much more.  In this targeted and educational SoC Conference; we address innovative IC- and IP-related solutions and technologies for emerging applications in AI, Machine Learning, Deep Learning, Storage/Data Centers, Autonomous Vehicles, Neuromorphic Computing, Robotics, IoT, Blockchain, Smart Home, Security, Aerospace Electrification, 5G Communications, H2M, and Industry 4.0.   SoC technologies and solutions that are used and/or targeted in the following seven tracks will be presented during the 18th International SoC Conference:  Wearable, Medical & Fitness RISC-V Based Solutions Blockchain & Security Autonomous Vehicles AI & Machine Learning IoT & IIoT Edge & Cloud Computing   Important Information & Date   March 26 – Deadline for Abstract Proposal Submissions April 17 — Acceptance Notifications Sent May 22 — Participation Acceptance Deadline August 2 — All Presentations Due September 14 & 15 — 18th International SoC Conference takes place in UC Irvine, Calit2 Building. 1. Please submit your proposed abstract for a 25-min technical PowerPoint presentation (1-2 short paragraphs in MS Word –no paper is required) along with the presenter’s picture and bio to the SoC Conference Technical Advisory Board (TAB) and SoC Conference Organizing Committee for review and consideration to MySoCconference@Gmail.com by Friday, March 26, 2021.  2. If you like to propose an idea for a Panel Discussion, please send us your suggestion (1-2 short paragraphs in MS Word) describing the panel topic, intended audience, and include a list of suggested participants. Please submit your Panel suggestion to MySoCconference@Gmail.com by Friday, March 19, 2021. 3. If your organization would like to arrange a ½ day or a full day Workshop at this targeted conference, please send us your workshop suggestion (1-2 short paragraphs in MSWord) describing topic, length of the workshop, and intended audience. Please submit your Workshop suggestion to: MySoCconference@Gmail.com by Friday, March 26, 2021. 4. IEEE-OC SSCS Student Design Posters Submissions (sponsored by IEEE SSCS-OC chapter), the contest promotes excellence in the engineering- and computer science-related designs within an academic environment and provides a forum in which undergraduate/graduate engineering and computer science students’ ingenuity can be shared with an audience of academic/industrial technical experts. The participating students will present their designs through posters at the 17th International SoC Conference. Students must submit their project abstracts by Friday, August 6, 2021, to: MySoCconference@Gmail.com. For more information or questions, please contact SoC Organizing Committee: MySoCconference@Gmail.com & 949-356-2399   5. IMPORTANT NOTE:  All speakers and panelists from the "non-sponsoring" and "non-exhibiting" companies and universities need to register for the International SoC Conference. For questions, please contact the SoC Conference Organizing Committee MySoCconference@Gmail.com or 949-356-2399. “As the industry continues its relentless drive to smaller and smaller geometries, deep technology understanding and strategic business engagements are required to deliver the innovative and complex System-on-Chip (SoC) solutions to a demanding market,” said Professor Michael Green, Chairman of Department of Electrical Engineering and Computer Science, University of California, Irvine. “The annual International System-on-Chip (SoC) Conferences have been an outstanding forum to gather the leading-edge technologies and products from industry leaders and highly-recognized academia into a two-day SoC Conference for those who are involved in designing complex ICs and IPs, researchers, semiconductor and EDA technologists, analysts, and students across the world.”

Topics of Interest

	The International System-on-Chip (SoC) Conference, the premier event devoted to Chip Design and Development. . .   The SoC Conference Organizing Committee & Technical Advisory Board are seeking submissions on all aspects of Chip Design & Development including:
	Semiconductor Technology AI Chips Blockchain Machine Learning solutions Neural interfaces and closed-loop systems; biosensors, microarrays, and lab-on-a-chip; wearable electronics; biomedical SoCs; 3D-IC Design & Packaging Analog, Mixed-Signal & RF Circuits and Systems SOI vs. CMOS for Analog & Digital Circuits CPU/DSP/GPU Cores High-Performance IO Sub-Systems & Interconnects Foundry Services & Technologies Novel CMOS Design Techniques EDA Tools, Algorithms, and Tool Usage Design Methodologies, Techniques, and Technologies for All Aspects of Electronic Circuits FPGA-Based Designs, Tools, and Applications Wireline and Wireless Communication Circuits and Systems Static, dynamic, and non-volatile memories for stand-alone and embedded applications Memory/SSD controllers High-bandwidth I/O interfaces Memories based on phase-change, magnetic, spin-transfer-torque, ferroelectric, and resistive materials Array architectures and circuits to improve low-voltage operation Power reduction, bit-error management, reliability, and fault tolerance; memory-subsystem enhancements, including in-memory logic functions Green Circuits, Systems, and Design Methodologies Embedded Memory Technologies & IPs Logic Synthesis and Circuit Optimization Timing and Circuit Analysis and Circuit Optimization Receivers/transmitters/transceivers for wireline systems, including backplane transceivers, optical links, chip-to-chip communications, 2.5/3D interconnect	IC & IP Design SiP and Innovative Packing Techniques Network-on-Chip (NoC) & System-Level Communication & Interconnects Special-purpose digital circuits, intra-chip communication circuits Clock-distribution techniques, soft-error and variation-tolerant circuits; Circuits for power management in digital applications Emerging IC and system solutions for: biomedical applications, sensor interfaces, Circuit Simulation and Interconnect Analysis Timing Analysis and Design for Manufacturability Physical Design and Manufacturability Power Analysis and Low-Power Design Validation, Test Planning, Testing and Coverage Formal Verification Signal Integrity and Design Reliability System-Level Design and Co-Design High-Level Synthesis Physical Synthesis Tools and Techniques Low-Power SoC Platforms Cost-Effective SoC-Based Platform Solutions Embedded Software, Tools and Design Embedded Design and Platforms Floor-Planning Beyond Die-Integration and Package/Hybrid/Board Design Novel Software Architecture for Multicore SoCs System Level Design Methodology, EDA and Design Tools for SoC Signal Integrity, Design for Testability, and Design Verification Design for Manufacturability, Variation-Aware Methodologies Emerging Specialized Design Technologies Manufacturing Test and Silicon Debug

In addition to conventional SoC-related topics, the SoC Conference invites proposals for topics for individual Tracks, Panels, Workshops and Tutorials.
 

SoC Conference Sponsorship opportunities	The SoC Conference provides a series of unique sponsorship opportunities for participating companies interested in promoting their names, logos, and brands and their products and technologies to a very targeted and interested audience To receive a complete listing of all available sponsorship opportunities, please contact MySoCconference@Gmail.com or call us at 949-356-2399. We will be more than happy to customize our sponsorship packages to meet your budget and your marketing objectives. SoC Conference Platinum and Gold sponsors’ logos will be displayed on the SoC Conference main page as well as on the Savant Company Web page until two weeks after the Conference. Sponsors’ logos are always displayed on the SoC Conference public archives page. Our Platinum and Gold sponsorship packages include Tabletop Exhibit opportunities, several complimentary Conference passes, and a variety of promotional opportunities. For specific sponsorship details, please contact MySoCconference@Gmail.com.
SoC Conference Tabletop   Exhibit	The SoC Conference Tabletop Exhibit is an outstanding, inexpensive forum for your Sales, Marketing, and Applications Engineering teams, allowing them to meet face-to-face with design engineers attending the Conference or visiting the Tabletop Exhibit.   To reserve your Tabletop Exhibit space please contact MySoCconference@Gmail.com.  SoC Conference Tabletop Exhibit provides several free full conference passes as well as a series of outstanding promotional opportunities for the exhibiting companies. Please contact us for more information and to receive the Tabletop Exhibit application/contract.
SoC Conference Speaking opportunities	Track and Session Presenters, Keynote Speakers, and Panel Members who can contribute their professional expertise have a wonderful opportunity to share their innovative SoC, ASIC, ASSP, FPGA, eFPGA, and Foundry-related technology or products at this event to a very focused and targeted audience. Technical presentations are invited that address new and previously unpublished results on System-on-Chip topics and related areas (as listed above).    To explore speaking opportunities at the 18th International SoC Conference, for information on our Tabletop Exhibit, or to develop highly targeted Workshops, please contact the SoC Conference Organizing Committee at:   MySoCconference@Gmail.com   or   949-356-2399
AUTHOR INFORMATION AND FORMAT	Presentations at the International System-on-Chip (SoC) Conference are in the form of 30-minute talks with PowerPoint slides. Presentation slides will be published in the SoC Conference Proceedings. Participants are not required to submit written papers, but a select group will be invited to submit a paper for inclusion in the SoC Conference Proceedings. Submissions must include a title, abstract (1-2 paragraphs in MSWord), and the presenter's contact information (name, affiliation, job title, bio, address, phone, fax, and email). Please indicate whether you have submitted, intend to submit, or have already presented or published a similar or overlapping submission to another conference or journal. Also indicate if you would like the submission to be held confidential. Submissions are evaluated by the SoC Conference Organizing Committee and the SoC Technical Advisory Board on the basis of the overall complexity of the technology or device, the degree of innovation, the incorporation of advanced technology, the potential market significance, and most importantly, the anticipated interest to the audience. Research and software proposals will be evaluated by similar criteria. If you are describing a product, you must indicate its status: its design, development, tape out, silicon, shipping, etc. Please submit your abstract in MSWord to: MySoCconference@Gmail.com.   Submissions containing figures may be submitted in .pdf, but plain ASCII text or MS Word is preferred.
Don't Miss Out!	Please submit your proposed Abstract & Bio ASAP for SoC Conference Organizing Committee & Technical Advisory Board Review and Consideration.
Questions	MySoCconference@Gmail.com    or   949-356-2399
Attendee  demographics	Attendee demographics for past SoC Conferences (based on job responsibilities): 62% SoC & ASIC Designers, Design Engineers, System Architects, and Engineering Management 23% University Engineering Professors and Engineering Students 9% Technical Marketing, Sales, or Business Development Management 4% Media, Strategic Planning, and Analysts 2% Other

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International System-on-Chip (SoC) Conference Technical Advisory Board

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