Aralis, Chief Technology Officer (CTO), and Vice President of R&D.
“What does a SoC look like
in 2025? Who, what and Why”
Abstract: The talk will
focus on changes in technology, applications, and economics of the SoC
ecosystem, and what it will likely mean for the realization of these devices
in the next decade. It will examine the way process technology, packaging
technology, design abstraction, and other such factors of true
differentiation will push these core devices. These observations are
intended to provide insights into where to position your company and career
for the coming decade.
Bio: Jim Aralis has served as
chief technology officer and vice president of R&D for Microsemi since
January 2007. He has more than 30 years experience in developing custom
analog device and process technologies, analog and mixed-signal ICs and
systems, and CAD systems. Jim played a key role in transitioning Microsemi to a virtually fabless
model, supporting multiple process technologies including, high voltage and
high power BCD/CMOS, high power high integration CMOS, GaAs, SiGe, IPD, RF
CMOS SoI, GaN, SiC, and several high-density packaging technologies.
From 2000 to 2007, Jim established and served as senior design director of
Maxim Integrated Product’s engineering center in Irvine, Calif. Before that,
he spent 7 years with Texas Instruments/ Silicon Systems as mixed-signal
design head and senior principal engineer. Additional experience includes 11
years with Hughes Aircraft Company in positions of increasing responsibility
including senior scientist. Jim earned a bachelor of science degree in
Math Applied Science and Physics and a master of science in electrical
engineering from UCLA. He holds 9 patents for circuit and system design.