11th International SoC Conference

* Program is subject to change. SoC Conference Organizing Committee, Technical Advisory Board (TAB), and Savant Company Inc. reserves the rights to revise or modify the SoC Conference program at its sole discretion.

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		Day One Wednesday October 23, 2013 SoC Conference Program Agenda*
	Savant Company Inc.	Farhad Mafie, SoC Conference Chairman, IEEE OC SSCS & OCEN Chairs. Welcome and Opening Remarks, Technology/Market Trends. Farhad Mafie is SoC Conference Chairman. He has over 20 years of experience in semiconductor and computer businesses and more than 10 years of university-level teaching experience. He is the former Vice President of Marketing and Engineering at Toshiba Semiconductor. He has also worked in strategic marketing, project and design engineering at Lucent Technologies, Unisys, and MSI Data. Farhad has a Master of Science and a Bachelor of Science degree in Electronic Engineering from California State University, Fullerton. He is an author and a translator, and his articles have been published in a variety of journals and Web-based magazines on technology and political affairs. In 2003, he published the biography of Iranian poet and Nobel nominee who lived in exile, Nader Naderpour (1929-2000), Iranian Poet, Thinker, Patriot. Farhad is also Editor-in-Chief for the CRC Press SoC Design and Technologies Book Series, which includes (1) Low-Power NoC for High-Performance SoC Design and (2) Design of Cost-Efficient Interconnect Processing Units. Farhad is an active member of IEEE, and he is the chair of IEEE Orange County Solid-State Circuits Society (SSCS), as well as IEEE Orange County Entrepreneurs' Network (OCEN). He is also a member of two UCI Advisory Committees: Communication System Engineering and Embedded System Engineering Certificate Programs.
		Analog and Mixed-Signal, SOI, and FinFET Technologies, Trends and Challenges for Complex SoC Designs. Track Chairman: Farhad Mafie, SoC Conference Chairman.
	Sierra Nevada Corporation	Dr. Vladimir Litvinov, Principal Scientist. GaN Spintronics. Abstract: We discuss gate-controlled spintronic applications of wide bandgap GaN-based semiconductors and compare them to their GaAs-based counterparts. Magnitude of Rashba interaction and its role in electrically driven magnetic properties of cubic and wirtzite III-V quantum wells are addressed in this presentation in relation to spin injection efficiency. High spin injection efficiency is the prerequisite of any voltage-controlled spin device. New materials as topological insulators are discussed with respect to their spintronic applications. Bio: Dr. V.I. Litvinov. Graduated from Lvov University (Radiophysics Department, Lvov, Ukraine), hold PhD degree in Solid State Theory (Chernovtsy University, Ukraine) and Habilitation Doctor degree in Physics and Mathematics (Institute of Physics, Estonian Academy of Science, Tartu, Estonia). Since 1978 he was a head of theoretical lab at the Institute of Material Science Problems, Academy of Science of Ukraine. In 1996-1999 he worked as a Senior Research Associate at the Department of Electrical & Computer Engineering, Northwestern University, Evanston, IL (USA). He joined Sierra Nevada Corporation in 1999. His areas of expertise include theory and modeling in semiconductor physics, III-V and IV-VI semiconductor optoelectronic devices, superlattices, metallic magnetic multilayers, and millimeter wave devices and antennas. Dr. Litvinov has served as a principal investigator on projects supported by the U.S. Air Force, SOCOM, U.S. Army, U.S. Navy, NASA, and MDA. He is a member of IEEE, American Physical Society, and Material Research Society. He has authored or coauthored more than 150 publications in peer-reviewed journals and conference papers.
	SOITEC	Bich-Yen NGUYEN, SOITEC “Fully Depleted SOI devices for SoC." Abstract: Fully Depleted SOI (FDSOI) devices have been developed in the last 20 years by academia and industry. Their benefits have been demonstrated including better immunity to short channel effects, lowest thresthold voltage variation due to minimizing the random doping fluctuation. More important, FDSOI devices on ultra-thin BOX (UTBOX) address a major challenge of the undoped channel devices, i.e. fabricate multiple threshold voltage, VT, requirement for SoC application. The ultra-thin-body and thin BOX (UTBB) devices feature the multi Vt-option with simpler integration by using the combination of top gate work function and ground plane doping type (N+ or P+ dopant). Additional special feature of the UTBB device is the back gate bias which can be utilized for further reducing the leakage or enhancing performance with dynamic VT modulation. FD-SOI is an evolutionary innovation because it has the advantage of being a planar fully depleted transistor which offers a minimum disruption design change and simpler integration for cost effective mobile SoC application. Bio: Bich-Yen Nguyen recently joined Soitec as a Senior Fellow supporting the technology development of new microelectronic devices and applications. Bich-Yen is also responsible for the Strategic Microelectronic Technology and Marking. Prior to joining Soitec, Bich-Yen was a senior manager at Freescale Semiconductor and a Freescale/Motorola Dan Noble Fellow. Bich-Yen has been recognized for her leadership and research in developing Freescale/Motorola's CMOS technology for advanced integrated circuit products. She also was instrumental in transferring process technology to production since 1980. Her honors and awards include recipient of Dan Noble Fellow in 2001, the highest technical award in Motorola, Master of Innovation Award in 2003. In 2004, she received the 1st National Award “Women in Technology Lifetime Achievement Award”. She holds over 130 worldwide patents and has authored more than 150 technical papers on IC process, integration and device technologies.
	X-FAB Semiconductor Foundries AG	Charles Hage, Vice President of Business Development at X-FAB Semiconductor Foundries AG. Complex Analog/Mixed-Signal SoCs - Why do more than 50% of the designs fail in the first iteration? Foundry Perspective on first-time-right performance for complex A/MS SoCs. Abstract: Achieving first-time right functional silicon in the first design iteration has become almost commonplace in the realm of digital IC design. The same does not hold true for analog/mixed-signal SoC designs. Although is it well understood what the challenges as well the solutions are to achieve first-time-right – only about 50% of all designs actually reach this important goal. This talk will cover the challenges involved in achieving first-time-right for analog/mixed-signal SoC designs, report on implementation issues and will discuss current performance metrics. It will highlight the ecosystem with all relevant market participants that are involved in the IC design process and their contribution required in achieving first-time-right. X-FAB as pure-play foundry is in the unique position to gauge and help first-time-right performance and therefore has a good insight into how many design iterations are typical for what type of designs. Differences in first-time-right performance with respect to applications, markets and regions will be discussed as well as the most common reasons for design failure. Bio: Charles Hage, Vice President of Business Development at X FAB. In his early days, Charles worked as a mixed signal design engineer for AMS and was later responsible for the design center south Germany from 1995 till 1999 when working for Thesys Mikroelektronik in Munich. Charles holds a Masters degree in electrical engineering with specialization in electronics and wave propagation from the University of Technology in Graz, Austria.
	Morning Break	Morning Break
	STMicroelectronics	Dr. Fred Gianesello. Low Cost Front End Module Integration on CMOS: the Era of SOI Technology. Abstract: During past years, RF ICs have achieved a very high level of integration in CMOS technology integrating highly dense digital function as well as high performances RF and analog ones (modern WiFi combo chip is a good example). The next challenge concerns now the development of low cost Front End Module (Power Amplifiers, switches, filters …) in CMOS technology. In this trend, SOI technology has emerged as a promising one enabling the introduction of high performances and low cost antenna switches on the market. This talk will propose an overview concerning the challenges posed by 3G/4G FEM and discuss how CMOS SOI technology enables to address those challenges. Bio: Dr. Fred Gianesello received the B.S. and M.S. degree in Electronics Engineering from Institut national polytechnique de Grenoble (Grenoble, France) in 2003 and the Ph.D. degrees in electrical engineering from the Joseph Fourier University (Grenoble, France) in 2006. Dr Gianesello has authored and coauthored more than 100 refereed journal and conference technical articles. He is currently working for STMicroelecetronics in Crolles (France) where he leads the team responsible for the development of electromagnetic devices (inductor, balun, transmission line, antenna, ...) integrated on advanced RF CMOS/BiMOS (down to 14 nm), Silicon Photonics and advanced packaging technologies (3D Integration, FOWLP, ...).
	Microsemi	Dr. Richard Newell, Senior Principal Product Architect, SoC Products Group, Microsemi Corporation. Recent Advances in FPGA Design Security Reduce Insider Threats. Abstract: Recent advances in FPGA security architectures show the promise of reducing insider threats at several stages of the supply chain. These include threats from insiders at the device manufacturer, overbuilding devices or selling "floor sweepings" (failed parts); through distribution, where parts may be re-marked with more expensive model numbers and sold to unsuspecting systems houses; to the end-user's manufacturing plant where there may be insiders over-building at the system-level or installing malicious code in place of the user's own design. From random bit generators to PUFs and elliptic curve cryptography, this talk will show how all the pieces fit together in a modern FPGA designed with enhanced security features to thwart the insider threat. Bio: Richard Newell is Senior Principal Product Architect at Microsemi Corporation, SoC Products Group where he has been active in planning the security features for the next generation of Flash-based FPGAs and customizable System-on-Chips (cSoCs) as well as expanding the available solutions for Microsemi’s current device families. Richard has an electrical engineering background, with experience in analog and digital signal processing, cryptography, control systems, inertial sensors and systems, and FPGAs. He is an alumni of the University of Iowa. He is the recipient of approximately one dozen U.S. patents and is a member of the Tau Beta Pi and Eta Kappa Nu honorary engineering societies.
	IBM	Dr. Chung-Hsun Lin, Manager, Exploratory Device Research. IBM T.J. Watson Research Center. FinFET Technology for SoC Application. Abstract: FinFET has been adopted to extend CMOS scaling beyond the sub-22nm node because of superior electrostatic control and lower sensitivity to random dopant fluctuations (RDF). This enables a very robust low-Vdd design spectrum. However, practical challenges and process complexity issues exist in the integration of FinFET structures at relevant technology dimensions. In this talk, we will address the device design consideration for SoC application, including, variability mitigation, multiple Vt tuning, and passive elements design, in FinFET technology for 14nm node and beyond. Bio: Dr. Chung-Hsun Lin received the B.S. and M.S. degrees in Electrical Engineering from National Taiwan University in 1999 and 2001, and the Ph.D. degree in Electrical Engineering from the University of California, Berkeley, in 2007. His Ph.D. work on FinFET compact modeling along with colleagues at UC Berkeley lead to the world first industrial standard FinFET SPICE model – BSIM-CMG. He joined IBM T.J. Watson Research Center in 2008 as a Research Staff Member in the area of CMOS technology and device modeling. He was involved in early FinFET device design study, TCAD/compact modeling and technology target definition, 22nm PDSOI technology bring up and power-performance optimization with colleagues at IBM. He is currently managing the exploratory device research group. Dr. Lin is a recipient/co-recipient of 2011 SRC Outstanding Industry Liaison Award. He was elected as IBM Master Inventor in 2012 for outstanding contribution to corporate's IP portfolio. He has authored or coauthored more than 70 technical papers and holds more than 25 US patents.
	Microsemi Keynote	Jim Aralis, Chief Technology Officer (CTO), and Vice President of R&D. Keynote: "Living on the Edge (of the SoC)" Abstract: This presentation will outline the new process, processor, and packaging technologies that are enabling the expansion of mixed-signal SoC product development efforts. Subjects that will be covered include the optimization of design methodologies, mode partitioning, and process selection to maximize cost-savings, performance, and time-to-market. The presenter will also discuss how expertise in analog processing, signal conditioning, precision timing, and high speed wired and wireless communications design remain critical for designing differentiated products in an expanding and evolving digital environment. Bio: Jim Aralis has served as chief technology officer and vice president of R&D for Microsemi since January 2007. He has more than 30 years experience in developing custom analog device and process technologies, analog and mixed-signal ICs and systems, and CAD systems. Jim played a key role in transitioning Microsemi to a virtually fabless model, supporting multiple process technologies including, high voltage and high power BCD/CMOS, high power high integration CMOS, GaAs, SiGe, IPD, RF CMOS SoI, GaN, SiC, and several high-density packaging technologies. From 2000 to 2007, Jim established and served as senior design director of Maxim Integrated Product’s engineering center in Irvine, Calif. Before that, he spent 7 years with Texas Instruments/ Silicon Systems as mixed-signal design head and senior principal engineer. Additional experience includes 11 years with Hughes Aircraft Company in positions of increasing responsibility including senior scientist. Jim earned a bachelor of science degree in Math Applied Science and Physics and a master of science in electrical engineering from UCLA. He holds 9 patents for circuit and system design.
	Lunch	Lunch
	Nokia Keynote	Dr. John Paul Shen, Nokia Fellow, Founding Head of Nokia Research North America Lab. Mobile Computing Mega Trends and Major Challenges. Abstract: This talk highlights four mega trends for mobile computing and the associated challenges. (1) Mobility Dominates: mobile devices will be the technology and innovation driver; (2) Wireless Clouds: the dominant edge of the cloud will become wireless; (3) Big Data Curating: inundation of massive amounts of real-time mobile data; (4) Energy Efficiency: improving the ratio of {UserExperience/(EnergyxCost)} becomes the new scaling law of 2X every 2 years. Bio: John P. Shen is a Nokia Fellow (7th in the company) and was the founding director of Nokia Research Center - North America Lab (formerly NRC Palo Alto) with research teams pursuing a very wide range of research projects in mobility and mobile computing. Prior to joining Nokia in 2006, John was the Director of the Microarchitecture Research Lab at Intel. Prior to joining Intel in 2000, John was a tenured Full Professor in the Electrical and Computer Engineering Department at Carnegie Mellon University, where he supervised a total of 17 PhD students and dozens of MS students, received multiple teaching awards, and published two books and more than 100 research papers. One of his books, “Modern Processor Design: Fundamentals of Superscalar Processors” (McGraw-Hill 2005) is still being used in the EE382 Advanced Processor Architecture course at Stanford University. He is currently an adjunct professor at the CMU Silicon Valley campus.
	Intel	Dr. Jeff Parkhurst, Program Director, Intel Science and Technology Centers. SoC Platform Opportunities and Challenges in the Big Data Economy.” Abstract: Processing Big Data has been traditionally done at the Cloud Level. However, the paradigm is shifting as the need to both mine and process Big Data at the edge becomes paramount. This talk will explore a new Big Data ecosystem and discuss how it intersects with current SoC platforms including exploring future opportunities and challenges. Bio: Dr. Jeff Parkhurst is the Program Director for three Intel Science and Technology Centers focusing on Embedded Computing, Cloud Computing and Big Data. He is responsible for managing the operational details in each center as well as aiding in direction setting of the research. The Program Director is the primary liaison between Intel and the universities on all operational matters including contracts, IP, space, logistics, funding, and technology/knowledge transfer. Prior to this assignment, Jeff was an Academic Research Programs Manager working with senior technologists internal and external to Intel setting research directions for the design science areas of the Semiconductor Research Corporation (SRC). Jeff received his BS from University of Nevada at Reno in 1983 and his MS from the University of California at Davis in 1988 and his PhD at Purdue University in 1994. Dr. Parkhurst is the author of numerous papers and one patent.
	University of Pennsylvania Keynote	Dr. Nader Engheta, H. Nedwill Ramsey Professor of Electrical and Systems Engineering, and Professor of Bioengineering. University of Pennsylvania "Seeing the Unseen: From polarization-sensitive eyes in nature to system-on-chip sensing and imaging devices." Abstract: Certain animal species in nature have visual systems that are sensitive to light’s polarization – a capability that is lacking in the human eyes. The species with polarization vision can detect this characteristic of image-forming light and can extract its information. Polarization is obviously an important feature of optical signals, and can be affected by surface shapes, materials, local curvature, and relative location of sources and objects, and thus it can provide useful information about the observed scene and objects. What can one learn from this interesting ability of polarization sensing and detection in nature that has been evolved in certain biological visual systems? Understanding the biophysical mechanism behind the polarization vision and reverse engineering its functionality leads to exciting novel methods and techniques in sensing and imaging with various applications. Inspired by the features of polarization-sensitive visual systems in nature, we have been developing various man-made, non-invasive imaging methodologies, sensing schemes and visualization and display schemes that have shown exciting and promising outcomes with useful applications in system design in the optical and microwave domains. These techniques provide better target detection, enhanced visibility in otherwise low-contrast conditions, longer detection range in scattering media, polarization-sensitive adaptation based on changing environments, surface deformation-variation detection, “seeing” objects in shadows, and other novel outcomes and applications. In this talk, I will discuss several optical aspects of the biophysical mechanisms of polarization vision, and present sample results of our bio-inspired imaging methodologies. (In collaboration with Professor Jan Van der Spiegel’s group at UPenn.) Bio: Recipient of 2013 SINA Award in Engineering and 2012 IEEE Electromagnetics Award, Nader Engheta is the H. Nedwill Ramsey Professor at the University of Pennsylvania with affiliations in the Departments of Electrical and Systems Engineering, Bioengineering, Physics and Astronomy, and Materials Science and Engineering. He received his B.S. degree from the University of Tehran, and his M.S and Ph.D. degrees from Caltech. Selected as one of the Scientific American Magazine 50 Leaders in Science and Technology in 2006 for developing the concept of optical lumped nanocircuits, he is a Guggenheim Fellow, an IEEE Third Millennium Medalist, a Fellow of IEEE, American Physical Society (APS), Optical Society of America (OSA), American Association for the Advancement of Science (AAAS), and SPIE-The International Society for Optical Engineering, and the recipient of 2013 Benjamin Franklin Key Award, 2008 George H. Heilmeier Award for Excellence in Research, the Fulbright Naples Chair Award, NSF Presidential Young Investigator award, the UPS Foundation Distinguished Educator term Chair, and several teaching awards including the Christian F. and Mary R. Lindback Foundation Award, S. Reid Warren, Jr. Award and W. M. Keck Foundation Award. His current research activities span a broad range of areas including metamaterials, nanophotonics, graphene optics, imaging and sensing inspired by eyes of animal species, optical nanoengineering, microwave and optical antennas, fractional operators in physics, and engineering and physics of fields and waves. He has co-edited the book entitled “Metamaterials: Physics and Engineering Explorations” by Wiley-IEEE Press, 2006. He was the Chair of the Gordon Research Conference on Plasmonics in June 2012.
	Morning Break	Afternoon Break
		Emerging & Leading-Edge Communication ICs, High-Speed I/Os & NoC Optical Communications. Track Chairman: Dr. Yasuo Hidaka is a senior researcher in Platform Technology Innovation Group at Fujitsu Laboratories of America.
	Pohang University of Science and Technology (Korea)	Professor Byungsub Kim. Revisiting High-Speed Interconnect Channel Modeling. Abstract: In this talk, modeling and analysis of RC-dominant wires for high-speed wireline transceiver design will be explained. A closed form formula derived from telegrapher’s equation accurately describes a frequency response of an RC-dominant wire, yet it is simple and intuitive for designers to easily understand design trade-offs without a complex numerical equation solver. This talk will also give explanation on how the model is derived and how it can help designers in example transceiver designs, Bio: TBD.
	Fujitsu Laboratories of America, Inc.	Dr. Yasuo Hidaka. Low-Frequency Equalizer for High-Speed I/O. Abstract: Equalizers are commonly used for multi-Gbps high-speed I/O in SoC in order to cancel ISI (inter-symbol interference) caused by frequency-dependent channel loss. Conventional equalizers such as FFE, CTLE, and DFE are quite effective for large high-frequency loss which often exceeds 30-40dB at Nyquist frequency for 10+Gbps. However, we also need to compensate for a small amount of loss at low frequency (e.g. 100 to 500MHz), because the skin effect in PCB starts at very low frequency (e.g. < 10MHz). Conventional equalizers cannot compensate for the low-frequency loss, because the slope of the low-frequency loss is too gentle (<3dB/dec) for FFE and CTLE which do not have a pole in low frequency and hence have only a steep (20dB/dec) slope above zero, and DFE cancels only short-term ISI. The low-frequency loss has often been overlooked or neglected, because 1) the loss is small (2 to 3dB), 2) the low-frequency loss is degenerated at DC and hardly recognized with a linear frequency axis which is the best to observe frequency dependence of skin effect and dielectric loss, 3) the long ISI tail in time-domain pulse response seems well cancelled at first glance by conventional equalizers only. However, the best link performance achieved by conventional equalizers has been significantly limited by lack of compensation for the small low-frequency loss. This presentation will demonstrate the performance advantage of the low-frequency equalizer which we have implemented together with CTLE and 2-tap DFE for high-frequency loss in our 32Gbps receiver using 28nm CMOS technology. Bio: Dr. Yasuo Hidaka is a senior researcher in Platform Technology Innovation Group at Fujitsu Laboratories of America, Sunnyvale, California. At FLA, he is working on research and development of high-speed interconnect technologies for Fujitsu Servers, primarily focusing on signal integrity problems of electrical interconnect from both sides of transmission channel and I/O circuit. He has acquired a broad range of in-depth experience and knowledge in his career in computer science, electrical engineering, and mechanical engineering, including but not limited to mixed-signal analog circuit, digital/analog signal processing, logic design and verification, high-speed analog circuit, adaptive control theory, IC layout design, wireless circuit, microwave engineering, ESD design, system bring up, chip characterization, manufacturing test, high-speed PCB design, processor architecture, parallel computer architecture, compilers, programming languages, operating systems, solid modeling, computer graphics, internet protocol, queuing theory, classical control theory, modern control theory, optimal control theory, statistical analysis, reliability analysis, device physics. He received his Ph.D. in Information Engineering from University of Tokyo in 1995 where his research focused on parallel computer architecture. He received M. Eng. in Information Engineering and B. Eng. in Precision Machinery both from University of Tokyo in 1991 and 1989, respectively. He co-authored 2 books, authored or co-authored 13 journal papers, and 14 peer-reviewed conference papers including 5 papers in ISSCC and 1 paper in ISCA which are top international conferences in the areas of circuit design and computer architecture, respectively. He holds 30 granted U.S. patents.
	UCLA	Dr. Brandon Buckley. Coherent Dispersive Fourier Transform for Real-time Digitization Abstract: Photonic time-stretch boosts the performance of analog-to-digital converters and digital signal processors by slowing down wideband analog signals before digitization. Real-time burst sampling rates exceeding 1 TSps have been demonstrated, along with similarly high-throughput digital processing. Additionally, by reducing effective aperture jitter, time-stretch transformation offers superior amplitude and temporal resolution across ultra-wide analog bandwidths. These capabilities are critical for high-performance applications such as signal integrity monitoring in optical networks, radar and electronic intelligence, and high-throughput screening in medicine and bio-defense. Recently, we have developed the coherent dispersive Fourier transformation, which enables real-time recovery of phase and amplitude information encoded on broadband optical pulses. By adapting this technology as a coherent receiver in photonic time-stretch, we are able to digitally compensate for non-linear distortions and dispersion induced fading. Here I will present our most recent results and discuss the impact on high-performance analog-to-digital conversion and signal processing. Bio: Dr. Brandon W. Buckley received his B.A. degree from Cornell University in 2007 and his M.S. and Ph.D. degrees from University of California, Los Angeles in 2009 and 2013, all in physics. In 2011, he spent a year at Intel Labs in Santa Clara, CA as a member of their Silicon Photonics Group. Brandon is currently a postdoc in Dr. Bahram Jalali’s Photonics Laboratory at UCLA developing ultra-fast optical instruments. His research interests include photonic enhanced analog-to-digital conversion and signal processing, integrated optics, and high-speed biomedical imaging.
	Purdue University	Dr. Byunghoo Jung, Associate Professor, School of Electrical and Computer Engineering, Purdue University. Wireless Links in 3-D ICs – The On-Chip Wide-Band Microbump Antenna Way Abstract: Three-dimensional integrated circuit (3-D IC) technology for improving integration density has made great progress, and its wide deployment in high performance computing systems has been envisaged during the recent years. For successful deployment, chip-scale network configuration and I/O connectivity are particularly important because of its strong correlation with architectural flexibility and expandability. Despite the high integration density in 3-D IC, there is a stringent constraint in its both internal and external connectivity. Wireless communication links between 3-D ICs provides a promising perspective for reducing latency and overall pin count. One of the biggest challenges in wireless links is a Si-compatible on-chip antenna with low cost and area overheads and high efficiency. Recently, an idea of using fully Si-compatible microbumps placed between the layers of 3-D IC as a high-efficiency, compact, and wide-bandwidth antenna was demonstrated. The wide-bandwidth microbump antenna allows a highly flexible wireless link with a data capacity comparable to that of a wireline link and shows high invariability over process variation. This opens an interesting paradigm of utilizing the wireless I/Os in future high-performance 3-D IC systems to improve the expandability and connectivity, while minimizing I/O pin counts and latency. This also offers a possibility of providing non-invasive wireless testing for 3-D ICs. Bio: Byunghoo Jung received the B.S. degree from Yonsei University, Korea, in 1990, the M.S. degree from KAIST, Korea, in 1992, and the Ph.D. degree from the University of Minnesota, Twin Cities, in 2005. From 1992 to 1999, he was with Samsung Electronics, Korea, where he was involved in the design of video signal driver circuits for flat panel display. Following receipt of his PhD in January 2005, he was with Qualcomm in San Diego as a Senior RF Design Engineer until he joined the School of Electrical and Computer Engineering at Purdue University in August 2005. His research interests include analog, mixed signal, and RF circuit design for wireless and wired communications and biomedical applications. He is the first place winner of the 2002-2003 SRC SiGe BiCMOS Design Challenge (as a lead designer) and the 2007-2008 SRC/SIA IC Design Challenge (as a lead faculty). He has served as a Co-Chair of the DAC/ISSCC Student Design Challenge, and as an Associate Editor of the IEEE Transactions on VLSI Systems. He is a member of the Analog Signal Processing Technical Program Committee in the IEEE Circuits and System Society.
	OPEN Alliance Broadcom	Dr. Ali Abaye, Senior Director of Product Marketing for the Infrastructure & Networking Group. OPEN Alliance: Supporting the Standardization of Automotive Ethernet. Abstract: In-vehicle electronics are growing in number and complexity, keeping step with technology advancements and capitalizing on consumer expectations for a connected driving experience. As a result of the significant increase in volume and complexity of in-car electronics, demand for networking solutions that offer low-cost, high speed transmission and bandwidth is on the rise. Standardization is essential as a major enabler for new and innovative in-vehicle applications, allowing automotive manufacturers to meet customer expectations and keep the bottom line in check. This presentation, delivered by Dr. Ali Abaye, Senior Director of Automotive and PHY Products at Broadcom and founding member of the OPEN Alliance SIG, explores the role of Ethernet in enabling advanced driver assistance, safety and infotainment features in next generation automotive networks and the role of the OPEN Alliance SIG. Bio: Dr. Ali Abaye serves as Senior Director of Product Marketing for the Infrastructure & Networking Group at Broadcom Corporation, responsible for the company’s networking portfolio of automotive devices and 1G and 10G copper physical layer transceivers (PHYs). Prior to Broadcom, Dr. Abaye served as System Architect for the Broadband and Wireless System Engineering division at Nortel. Prior to Nortel, he held various technical and strategic marketing positions at Centillium Communications. Dr. Abaye holds a Ph.D. in Electrical Engineering from Southern Methodist University in Dallas, Texas.
	Università di Ferrara	Professor Luca Ramini, Università di Ferrara. Optical Interconnect Technology for 3D Stacked Multi- and Many-Core Systems: When, Where and How. Abstract: Optical Networks-on-Chip (ONoCs) are considered a promising way of improving power and bandwidth limitations in next generation multi- and many-core integrated systems. Today, many research works on optical on-chip networks have been proposed in the recent literature, however, they are fundamentally still at the stage of a promising research concept, thus neglecting cross-layer design issues. This presented talk focuses on Optical NoC topologies, especially wavelength-routed ones (WRONoCs), for 3D stacked systems, and addresses the design predictability gap when moving from abstract logic schemes of interconnect topologies to their physical implementation. In light of this, the work discloses the key role of placement and routing constraints for optical on-chip networks as a way of emphasizing the gap between the Optical Network-on-Chip (ONoC) concept and a viable interconnect technology with practical relevance. In addition, the robustness of ONoC topologies to such constraints, and different implementation workarounds such as global connectivity and network partitioning will be discussed. Finally, the presented work makes interesting insights into the comparison between optical filter-based topologies vs. spatial-division-multiplexing ring topologies, by assessing physical design trade-offs of an engineered optical layer for a 3D-stacked multi-core processor. Bio: Luca received the M.S. degree in engineering and technologies for Telecommunications and Electronics in the 2010. His first studies on Silicon Photonics Technology have been started during his master thesis entitled “ Modeling of microcavities based on photonic crystal technology”. Since June 2010 Luca is working in the MPSoC Research Group under the supervision of the professor Davide Bertozzi at the Engineering Department of the University of Ferrara, in Italy. Luca has started his PhD degree on January first 2011 which is completely funded by the Photonica Project. His current research interests include design of photonics interconnect networks and modeling and simulation of photonics devices for multi-processor system on chip. Luca has expertise on the FDTD Method, which is mainly utilized for the modeling at physical level of photonic switching elements, and on the SystemC simulation framework for the characterization at system level of Optical Networks-on-Chip. Luca’s current research is focused on a design space exploration of Wavelength-Routed optical NoC topologies for a 3D-Stacked Multi-Core processor of practical relevance, leveraging on Place and Route Constraints to quantify the deviation between logic topologies and corresponding physical ones in terms of insertion loss, delays and power. Since June to December 2011, Luca visited the research group of Professor Luca Carloni at Columbia University in the city of New-York. Luca has also presented and shared his research interests at several international conferences and workshops, among the most recent we remember: Asia Communication and Photonics Conference’12 in Guangzhou (China), DATE’13 conference in Grenoble (France) as well as the latest CMOS’13 Emerging Technologies Research symposium in Whistler (Canada). Luca is finally co-author of seven publications focused on optical Networks-on-Chip and he is currently writing his first book chapter on this emerging technology as well.

		Day TWO Thursday, October 24, 2013 SoC Conference Program Agenda*
	Savant Company Inc.	Farhad Mafie, SoC Conference Chairman, IEEE OC SSCS & OCEN Chairs. Bio: Farhad Mafie is SoC Conference Chairman. He has over 20 years of experience in semiconductor and computer businesses and more than 10 years of university-level teaching experience. He is the former Vice President of Marketing and Engineering at Toshiba Semiconductor. He has also worked in strategic marketing, project and design engineering at Lucent Technologies, Unisys, and MSI Data. Farhad has a Master of Science and a Bachelor of Science degree in Electronic Engineering from California State University, Fullerton. He is an author and a translator, and his articles have been published in a variety of journals and Web-based magazines on technology and political affairs. In 2003, he published the biography of Iranian poet and Nobel nominee who lived in exile, Nader Naderpour (1929-2000), Iranian Poet, Thinker, Patriot. Farhad is also Editor-in-Chief for the CRC Press SoC Design and Technologies Book Series, which includes (1) Low-Power NoC for High-Performance SoC Design and (2) Design of Cost-Efficient Interconnect Processing Units. Farhad is an active member of IEEE, and he is the chair of IEEE Orange County Solid-State Circuits Society (SSCS), as well as IEEE Orange County Entrepreneurs' Network (OCEN). He is also a member of two UCI Advisory Committees: Communication System Engineering and Embedded System Engineering Certificate Programs.
		Leading-Edge Technologies and Design Methodologies & Approaches for Emerging Complex SoCs. Track Chairman: Dr. Wakaba K. Wakabayashi. NEC.
	Semtech Corporation	Dr. Amr Fahim, Principal Design Engineer. Efficient and Accurate Frequency Synthesizer Model for SoC Processors. Abstract: Transient domain simulation is a critical step in the verification flow of system-on-a-chip (SoC) processors. This is often complicated by the presence of custom analog circuitry on the chip that must be taken into account. One such block that is needed in virtually all SoC processors is the phase-locked loop (PLL). In conventional Verilog-based methodologies, the PLL functionality is bypassed and replaced with a very crude functional model. Although, this may be sufficient for basic static functionality, it completely ignores the loop dynamics, which may be critical to model. There have been recent attempts in providing some PLL functionality, but on the expense of a much longer simulation time. In this paper, a novel method of modeling a phase-locked loop that is suitable for system-on-a-chip (SoC) processors is described. A computationally efficient and accurate model of a PLL is described. Simulations show that transistor level accuracy is achieved with orders of magnitude is speed-up. In addition to functionality, jitter is also accurately predicted as compared to measured results. Bio: Dr. Amr Fahim received his B.A.Sc. degree in computer engineering and M.A.Sc. and Ph.D. degrees in electrical engineering from the University of Waterloo, Ontario, Canada in 1996, 1997 and 2000 respectively. He has over 17 years of experience in design of RF/mixed-signal IC design for system-on-a-chip (SoC) processors for both wireless and wireline products, developing innovative solutions to meet the demands of these markets. He is the author of over 25 papers and 15 patents. He is also the author of the text book entitled "Clock Generators for SoC Processors" and has been a reviewer and Associate Editor for several IEEE journals including the Journal of Solid-State Circuits, IEEE Transactions on Circuits and Systems II, and the IEEE Transactions on VLSI. He is currently with Semtech Corporation, Irvine, CA. His research interests include frequency synthesizers and RF/mixed-signal SoC integration.
	Spansion Inc.	Shiva Shetty, Director of R&D Product Engineering Group at Spansion. Advancement in Charge-Trap Flash Memory Technology. Abstract: Charge-trap Flash has been scaling effectively and successfully productized in high volume for several technology generations. As a result of its high intrinsic reliability, small cell size, and good performance at elevated temperatures, charge-trap Flash has captured a significant portion of the market. Two-bit-per-cell MirrorBit® charge-trap technology has been the industry benchmark for NOR Flash for more than a decade, spanning six generations of scaling, and is now ubiquitous in high-density parallel and serial NOR applications. In fact, 45nm MirrorBit technology is in volume production today with an 8Gb chip—the highest-density monolithic NOR flash in the market. Meanwhile, 32nm MirrorBit cell has been demonstrated and will enable even higher densities of monolithic NOR Flash. For NAND applications, the industry’s first manufacturing-ready, charge-trap NAND technology called Heterogeneous Charge Trap (HCT)TM NAND Flash has been recently developed. For SoC products with ultra-fast read access time, embedded Charge Trap (eCT)TM Flash is being developed and integrated with an advanced logic process. The planar cell structures will enable continued scaling of these charge-trap technologies, while new architectures such as 3D charge-trap Flash will emerge and further extend the density-growth trend. This presentation will cover technological advancements and key attributes of these charge-trap technologies. Bio: Shiva Shetty currently is director of R&D Product Engineering group at Spansion, a leading provider of Flash memory based solutions. He leads a team responsible for characterizing and qualifying test chips and products on new technologies. He received his B.S degree from Indian Institute of Technology, Bombay in 1996 and his M.S. in Electrical Engineering from Rensselaer Polytechnic Institute, Troy, NY in 1998. Since then, he has worked at AMD and Spansion and has been part the of various technology development teams that developed and qualified several generations of logic and flash memory technologies.
	SP3 Diamond Technologies	Dr. Mario M. Pelella. Ultimate Solution for 3D-IC Technologies. Abstract: To continue the insatiable performance and functionality gains of the last four decades, while empowering future heterogeneous super systems on a package with “More-than-Moore” integration, the development of a 3D-IC substrate platform is essential and a key enabling technology that will fuel the growth of Semiconductor industry over the next four decades. While the benefits are clear (smaller footprint, reduced interconnect delays, lower power, and higher bandwidth), the design complexities of 2D platforms are further aggravated in a 3D environment due to yield, thermal management, TSV integration, and design complexity concerns. Spatially elevated operating temperatures within the 3D-IC stack, due to poor thermal conductivity of conventional materials, aggravates the latency and timing between chips, degrades reliability, and reduces the overall performance of the system. Moreover, the most significant barrier to continued system performance improvements today is power limitations. To circumvent these onerous thermal management issues, a significantly higher thermal conductivity material needs to be incorporated into the 3D-IC stack, which diamond films can provide. The key attributes of diamond interposers include a CTE matched stack, high Young’s modulus, high thermal conductivity, and compatibility with existing copper damascene processing. Furthermore, to mitigate thermal management issues and the integration costs of interposers, the utilization of SOD (silicon-on-diamond) substrates within the 3D-IC stack would provide the ultimate solution for 3D-IC technologies and can be available in wafer sizes of 100 – 300mm to support the industry. The benefits and challenges of incorporating diamond films into the 3D-IC stack will be analyzed and discussed. Bio: Dr. Mario Pelella, is the company’s vice president of engineering. As the leader of Technology and Process Solutions group, Mario is responsible for the development and technical success of all sp3’s semiconductor and MEMS-related diamond products. He previously served as director of technology solutions at SVTC Technologies where he was responsible for developing SVTC’s technology roadmap for the semiconductor, aerospace and defense, MEMS, life science, photonic and energy industries. He has also held positions with tau-Metrix, AMD and IBM. Mario earned his Ph.D. in Electrical Engineering from the University of Florida and BSEE and MSEE degrees from Clarkson University. He holds over 50 US patents and 15 worldwide patents and is the author of more than 60 publications, including three that earned Best Paper awards.
	Palmchip	Jauher Zaidi, Chairman & CTO, Palmchip. Securing the "Internet of Things”. Abstract: The Internet of Things (IOT) is the term for the phenomenon where people and things (physical devices such vehicles, commercial and industrial equipment, medical devices, remote sensors, etc.) are connected to networks that are linked to the Internet and communicating vast amounts of valuable data. While the idea is not new, the recent proliferation creates a sense of urgency to better understand and develop edge devices which are secure. Personal privacy and Security is huge concern. We must design IoT devices with built in Security. IoT Security can not be a after thought. Cisco reports over 50B devices will be connected to internet by 2020. Bio: Jauher Zaidi is Chairman & CTO of Palmchip Corporation. Jauher has over twenty years of experience in system design and integration. Before founding Palmchip in 1996, he was involved in system-on-chip (SoC) integration at Quantum Corporation. Jauher received his BSEE and MSEE degrees from Pacific States University in Los Angeles, California. He has also participated in many SoC panels and is a recognized expert in the area of SoC development.
	GLOBALFOUNDRIES	Dr. An Chen, Senior member of Technical Staff. Beyond-CMOS Devices for Low-Power System Design. Abstract: Increasing power density and heat dissipation with CMOS scaling have motivated the research community to pursue low-power devices and designs. Although non-planar structures and alternative channel materials improve electrostatics and help to extend CMOS scaling, the fundamental switching energy limit in conventional charge-based device models imposes ultimate energy constraints in highly scaled CMOS devices. Switching devices based on unconventional mechanisms or even alternative state variables have been explored to circumvent this limit for low-power applications. Steep sub-threshold slope (SS) devices either utilize internal gain or overcome thermal limit to achieve <60mV/dec SS. Unconventional charge-based logic devices exploit novel switching mechanisms different from conventional field-effects, e.g., tunneling transport, discrete quantum states, phase transition, Coulomb coupling, etc. Non-charge state variables (e.g., spin) may also enable logic operations that could potentially reach very lower power consumption. Despite the promising low-power characteristics, these beyond-CMOS devices also face different challenges, e.g., speed, material, scalability, etc. Systematic benchmark of these beyond-CMOS devices has also revealed performance-power tradeoffs. Interconnect solutions for beyond-CMOS devices remain unproven. These challenges have to be addressed in circuit/system designs that may utilize unique characteristics of these novel devices, e.g., built-in nonvolatility in logic functions. Memory-logic integration may enable more energy-efficient system designs. Emerging devices with structures and materials compatible with CMOS have significant advantages. Beyond-CMOS technologies may need to shift from device-centric toward design-centric to overcome device-level limitations. Bio: Dr. An Chen is a senior member of technical staff at GLOBALFOUNDRIES, working on emerging logic and memory technologies. He is the Technical Lead on emerging nonvolatile memories in the Exploratory Research group. He received the Ph.D. degree in Electrical Engineering from Yale University. He previously worked at Spansion on emerging memories and at AMD as an assignee to the Nanoelectronics Research Initiative. He is the chair of the Emerging Research Device (ERD) chapter of the International Technology Roadmap of Semiconductors (ITRS).
	Morning Break	Morning Break
	NEC ALDEC	DR. Wakaba K.Wakabayashi. FPGA+C-based HLS Can Outperform GPGPU (SIMD Processors) from the View Point of Compiler and Architecture. Abstract: TBD. Bio: Dr. Kazutoshi Wakabayashi, received his B.E. and M.E. degrees and ph.D from the University of Tokyo in 1984,1986 and 2006. He was a visiting researcher at Stanford University during 1993 and 1994. He joined NEC Corporation in Kawasaki Japan in 1986 and he is currently a Senior Principal Researcher of Central Research Labs. NEC Corporation. Dr. Wakabayashi has been engaged in the research and development of VLSI, CAD systems; high-level and logic synthesis, formal and semi-formal verification, system-level simulation, HDL, emulation, HLS and Floorplan links, and reconfigurable computing. He served on executive committee or organizing committee of some international conference including: ASP-DAC'09 General Chair, CODES+ISSS'09 Co-Technical Program Chair. a Secretary of Steering Committee of ASPDAC, and Executive Committee for ICCAD and DAC, Tutorial Chair of ASPDAC2006, Steering Committee of ITC-CSCC (09-). He has served on the program committees for several international conferences including: DAC, ICCAD, DATE, ASP-DAC, ISSS, SASIMI, and ITC-CSCC, ISCAS, VLSI-TSI, SBCCI, VLSI Design, ESS, ISLP and so on. Also, he has served as a general chair, a secretary, and a Technical Program Committee member for a number of Japanese conferences, including: Institute of Electronics, Information and Communication Engineers of Japan (IEICE), the Information Processing Society of Japan (IPSJ), System LSI WS, Karuizawa WS. He is currently chair of SIG on VLSI design methodology of IEICE, and elected member of IEICE. He was an associate editor of Transactions on IEICE on VLSI CAD, DAEM. He is a rep. of CEDA (Council for EDA) of IEEE. He is also a member of IEEE, IPSJ, and IEICE. He received the IPSJ Kiyasu Special Industrial Achievement Award 2011, the Yamazaki-Teiichi Prize in 2004, and the IPSJ Convention Award in 1988, Sakai Kinen Special Award in 2001, and the NEC Distinguished Contribution Award in 1993 for his logic synthesis system and in 1999 for his formal verification and in 2006 for his High Level Synthesis. His C-based Synthesis and Verification tool suite called "CybeWorkBench" received a Grand prize of "LSI of the Year 2003" and "LSI of the Year 2007".
	UCI	Professor, Nader Bagherzadeh, UCI, EECS. Exascale and Embedded Systems Have Common Goals? Abstract: This talk will address some of the challenges facing designers of embedded systems as well as supercomputers. In particular the foci will be on power consumption and performance issues that are considered as major hurdles in order to meet design specification objectives. Bio: Dr. Nader Bagherzadeh has been involved in research and development in the areas of computer architecture, reconfigurable computing, VLSI chip design, and computer graphics. For almost ten years ago, he was the first researcher working on the VLSI design of a Very Long Instruction Word (VLIW) processor. Since then, he has been working on multithreaded superscalars and their application to signal processing and general purpose computing. His current project at UC, Irvine is concerned with the design of coarse grain reconfigurable pixel processors for video applications. The proposed architecture, called MorphoSys, is versatile enough to be used for digital signal processing tasks such as the ones encountered in wireless communications and sonar processing. DARPA and NSF fund the MorphoSys project (total support $1.5 million). Dr. Bagherzadeh was the Chair of Department of Electrical and Computer Engineering in the Henry Samueli School of Engineering at University of California, Irvine. Before joining UC, Irvine, from 1979 to 1984, he was a member of the technical staff (MTS) at AT&T Bell Laboratories, developing the hardware and software components of the next-generation digital switching systems (#5 ESS). Dr. Bagherzadeh holds a Ph.D. in computer engineering from The University of Texas at Austin. As a Professor, he has published more than a hundred articles in peer-reviewed journals and conference papers in areas such as advanced computer architecture, system software techniques, and high performance algorithms. He has trained hundreds of students who have assumed key positions in software and computer systems design companies in the past twelve years. He has been a Principal Investigator (PI) or Co-PI on more than $2.5 million worth of research grants for developing next-generation computer systems for solving computationally intensive applications related to signal and image processing.
	Intel	Dr. Jeff Parkhurst, Program Director, Intel Science and Technology Centers. SoC Platform Opportunities and Challenges in the Big Data Economy.” Abstract: Processing Big Data has been traditionally done at the Cloud Level. However, the paradigm is shifting as the need to both mine and process Big Data at the edge becomes paramount. This talk will explore a new Big Data ecosystem and discuss how it intersects with current SoC platforms including exploring future opportunities and challenges. Bio: Dr. Jeff Parkhurst is the Program Director for three Intel Science and Technology Centers focusing on Embedded Computing, Cloud Computing and Big Data. He is responsible for managing the operational details in each center as well as aiding in direction setting of the research. The Program Director is the primary liaison between Intel and the universities on all operational matters including contracts, IP, space, logistics, funding, and technology/knowledge transfer. Prior to this assignment, Jeff was an Academic Research Programs Manager working with senior technologists internal and external to Intel setting research directions for the design science areas of the Semiconductor Research Corporation (SRC). Jeff received his BS from University of Nevada at Reno in 1983 and his MS from the University of California at Davis in 1988 and his PhD at Purdue University in 1994. Dr. Parkhurst is the author of numerous papers and one patent.
	Lunch	Lunch
	Xilinx, Inc. Keynote	Dr. Kees Vissers, Distinguished Engineer. Keynote: “The future of Programming the Zynq SoC platform." Abstract: In this keynote we will introduce the Zynq architecture, and we will show that this is ideally suited to program this architecture to become your own SoC. We will show the system architecture, the programming environment and the direction of next generation tools. We will illustrate how this is programmed starting with an algorithm in OpenCV. We will show an edge detection based motion detection application that is indicative for the workloads of embedded vision applications. We will show the mapping on the Zynq processor + FPGA fabric, and will show the performance in the range of 1 fps on Intel processors with OpenCV libraries, in the range of one frame per several seconds on the ARM processors, and a full 1080P 60fps for the implementation on the FPGA. We will show the measured low power consumption of the total system. Bio: Kees Vissers graduated from Delft University in the Netherlands. He worked at Philips Research in Eindhoven, the Netherlands, for many years. The work included Digital Video system design, HW –SW co-design, VLIW processor design and dedicated video processors. He was a visiting industrial fellow at Carnegie Mellon University, where he worked on early High Level Synthesis tools. He was a visiting industrial fellow at UC Berkeley where he worked on several models of computation and dataflow computing. He was a director of architecture at Trimedia, and CTO at Chameleon Systems. Today he is heading a small team of researchers at Xilinx. The research topics include next generation programming environments for processors and FPGA fabric, high-performance video systems, wireless applications and new datacenter applications.
		Analog and Mixed-Signal SoC Solutions, Tools, Verification Methodologies & Challenges. Track Chairman: Dr. Kaushik Sengupta, Princeton University.
	Synopsys	Ken Brock, Product Marketing Manager, Logic Libraries. The Impact Of FinFET Technology On Mixed-Signal SoC Designs. Abstract: In order to fully realize the advantages of FinFET devices, analog/mixed-signal design must follow the same trajectory that has benefited digital design. That is: scaling, lower power consumption and higher speeds. To achieve this, analog/mixed-signal development techniques and design styles have to be re-created and implemented with very close foundry co-operation. This presentation will highlight: 1) the FinFET transistor characteristics that make them different for analog/mixed-signal design IP design compared to planar devices; 2) the impact FinFETs have on existing circuit designs and layout topologies for DDR, USB, PCI Express and foundation IP such as memories and libraries; 3) methodology that incorporates advanced process qualification vehicles; 4) an integrated test, repair and diagnostics solution that supports repairable or non-repairable embedded memories. Bio: Ken is the Product Marketing Manager for Logic Libraries at Synopsys He works with advanced node SoC design teams and leading foundries to provide physical IP solutions for optimal performance, power, area and yield. Mr. Brock has served in the IP and EDA industries for over twenty-five years in technical, marketing, management, professional service, and product development at Virtual Silicon, Collett International, Compass Design Automation, Mentor Graphics, and Silicon Compilers. He chaired the Global Semiconductor Alliance’s Analog/Mixed Signal Working Group that produced the AMS/RF SPICE Model, PCM and PDK Checklists used by leading foundries. He holds a BSEE and MBA from Fairleigh Dickinson University. Navraj S. Nandra, Senior Director Analog/Mixed-Signal IP Bio: Navraj Nandra joined Synopsys in February 2005 and is the senior director of marketing for the DesignWare Analog/Mixed-signal IP, embedded memories and logic libraries. He has worked as an analog/mixed signal IC designer for Philips Semiconductors, Austria Micro Systems, (San Jose & Austria) and EM-Marin (Switzerland). Navraj holds a masters degree in Microelectronics, majoring in analog IC design, from Brunel University and a post-graduate diploma in Process Technology from Middlesex University.
	University of California, San Diego (UCSD)	Dr. Patrick Mercier, Assistant Professor, Department of Electrical and Computer Engineering. Authors: Patrick P. Mercier, Saurav Bandyopadhyay, Andrew C. Lysaght, Konstantina M. Stankovic, Anantha P. Chandrakasan. Powering Wireless Devices from the Biologic Battery in the Inner-Ear. Abstract: The human body is a tremendous energy factory. In this work, we explore harvesting a very small fraction of this energy to power small wireless sensing devices. Specifically, the endocochlear potential – a 70-100 mV biologic battery that naturally powers hearing in the mammalian inner-ear – is explored as an energy source for electronics. Due to anatomically-limited sizes, electrodes that interface between electronics and the inner-ear are small, resulting in large (> 1 MΩ) impedances. Such impedances limit extractable power from the endocochlear potential to the order of a nanowatt. Although such a power budget is extremely minimal, we will show new RF and energy management architectures that leverage extreme duty-cycling and standby energy efficiency techniques to achieve enabling power consumptions that are an order of magnitude lower than previous work. Measurement results demonstrating a fully-functional initial prototype will be presented. Bio: Patrick Mercier joined the Electrical and Computer Engineering department at UC San Diego as an Assistant Professor in 2012. He received his Ph.D. degree from the Massachusetts Institute of Technology (MIT) in 2012, with a doctoral thesis on the topic of communication and energy delivery architectures for personal medical devices. Prior to that, he received his S.M. degree from MIT in 2008, and his B.Sc. degree from the University of Alberta, Canada, in 2006. Prof. Mercier received the International Solid-State Circuits Conference (ISSCC) Jack Kilby Award for Outstanding Student Paper at ISSCC 2010, an Intel Ph.D. fellowship in 2009, Natural Sciences and Engineering Council of Canada (NSERC) Postgraduate Scholarships in 2007 and 2009, and an NSERC Julie Payette fellowship in 2006. His research interests include the design of energy-efficient digital systems, RF circuits, power converters, and sensor interfaces for biomedical and implantable applications.
	University of California, Davis	Dr. Omeed Momeni, Assistant Professor. Terahertz and mm-Wave Power Generation and Amplification: Reaching the Fundamental Limits. Abstract: There is a growing interest in terahertz and mm-wave systems for compact, low cost and energy efficient imaging, spectroscopy and high data rate communication. Unfortunately, today's solid-state technologies including silicon and compound semiconductors can barley cover the lower part of the terahertz band. In order to overcome this limitation, we have introduced systematic methodologies for designing circuits and components, such as signal sources and amplifiers operating close to and beyond the conventional limits of the devices. These circuit blocks can effectively generate and combine signals from multiple devices to achieve performances orders of magnitude better than the state of the art. As an example, we show the implementation of a 482 GHz oscillator with an output power of 160 W (-7.9 dBm) and a 260 GHz amplifier with a gain of 9.2 dB and saturated output power of -3.9 dBm, both in 65 nm CMOS process. Bio: Omeed Momeni received the B.Sc. degree from Isfahan University of Technology, Isfahan, Iran, the M.S. degree from University of Southern California, Los Angeles, CA, and the Ph.D. degree from Cornell University, Ithaca, NY, all in Electrical Engineering, in 2002, 2006, and 2011, respectively. He joined the faculty of Electrical and Computer Engineering Department at University of California, Davis in 2011. He was a visiting professor in Electrical Engineering and Computer Science Department at University of California, Irvine from 2011 to 2012. From 2004 to 2006, he was with the National Aeronautics and Space Administration (NASA), Jet Propulsion Laboratory (JPL), to design L-band transceivers for synthetic aperture radars (SAR) and high power amplifiers for Mass Spectrometer applications. His research interests include mm-wave and terahertz integrated circuits and systems. Prof. Momeni is the recipient of the Best Ph.D. Thesis Award from the Cornell ECE Department in 2011, the Outstanding Graduate Award from Association of Professors and Scholars of Iranian Heritage (APSIH) in 2011, the Best Student Paper Award at the IEEE Workshop on Microwave Passive Circuits and Filters in 2010, the Cornell University Jacob’s fellowship in 2007 and the NASA-JPL fellowship in 2003.
	Princeton University	Dr. Kaushik Sengupta. Electromagnetic and Circuit Co-Design. Abstract: After Maxwell reunified the Electro-magnetic spectrum in the 1850s, the spectrum broke on frequency lines into separate, specialized and mature disciplines of study for completely different applications. Almost a century and half later, we see a reunification of electromagnetism in one single platform, opening up opportunities to create cutting-edge technology for the next-generation systems. Having the ability to synthesize, control and manipulate such a large portion of the spectrum (DC-THz) with a billion transistors in a single platform, silicon, opens up a plethora of opportunities spanning a wide range of applications in sensing, imaging, spectroscopy, medical diagnostics, communication and beyond. Such unprecedented levels of integration can be leveraged only we remove the artificial partitions among various levels of abstraction in system design such as analog, digital, electromagnetics, antenna, communication and control theory and take a holistic approach. In this talk, I will show some practical examples how such an approach enables us to go beyond transistor speed limits into developing fully integrated CMOS systems terahertz frequency range (0.3-3 THz) for applications in sensing, imaging, radar and ultrafast wireless communication. The intersection of analog, digital and RF creates new opportunities for novel, self-healing system design for future cognitive and self-healing system wireless systems and we will discuss a fully integrated, closed loop and autonomous self-healing mm-wave power amplifier capable mitigating process variations, load mismatches, unintentional failures and even laser blasts! Bio: Kaushik Sengupta received the B.Tech. and M.Tech. degrees in electronics and electrical communication engineering, from the Indian Institute of Technology, Kharagpur in 2007 and M.S and Ph.D. degrees in electrical engineering from California Institute of Technology in 2008 and 2012 respectively. He joined the faculty of the department of electrical engineering at Princeton University in February 2013. His research interests are in the areas of high frequency integrated circuits, electromagnetics, optics for various applications in sensing, imaging and high-speed communication. During his undergraduate studies, he did research at University of Southern California and Massachusetts Institute of Technology, in the summers of 2005 and 2006, where he worked on nonlinear integrated systems for high purity signal generation and low-power RFID tags respectively. During his undergraduate studies, he performed research at the University of Southern California, and the Massachusetts Institute of Technology, in the summers of 2005 and 2006, where he was involved with nonlinear integrated systems for high-purity signal generation and low-power RF identification (RFID) tags, respectively. Dr. Sengupta received the Charles Wilts prize for the best thesis in Electrical Engineering at Caltech. in 2012-13. He was the recipient of the IBM Ph.D. fellowship (2011-12), the IEEE Solid State Circuits Society Predoctoral Achievement Award, the IEEE Microwave Theory and Techniques Graduate Fellowship, and the Analog Devices Outstanding Student Designer Award (2011). He was also the recipient of the Prime Minister Gold Medal Award of IIT (2007), the Caltech Institute Fellowship, the Most Innovative Student Project Award of the Indian National Academy of Engineering (2007), and the IEEE Microwave Theory and Techniques Undergraduate Fellowship (2006). He was the co-recipient of IEEE RFIC Symposium Best Student Paper Award in 2012.
	Broadcom Corporation	Dr. Hooman Darabi. Receiver Architectures for Blocker Tolerant Software Radios. Abstract: The cost concerns of the market today dictate several stringent requirements on the radios such as high level of integration, small die size, and low power consumption. Moreover the spectrum availability has become a recent challenge which ultimately translates into cost as well. In this presentation various receiver architectures suitable for SDR and cognitive applications is proposed and discussed. To break the traditional noise-linearity-matching trade-off, we offer an alternative topology that uses two down-conversion paths with no voltage amplification prior to baseband filtering. Using wideband noise-cancelling, an 80 MHz to 2.7 GHz prototype of the receiver achieves sub-2 dB noise figure that degrades to 4.1 dB in the presence of an out-of-band 0 dBm blocker. Out-of-band IIP3 is measured at +13.5 dBm, and P-1dB blocker compression is close to 0 dBm, making the topology very attractive for SAW-less cognitive radios. Bio: Dr. Hooman Darabi was born in Tehran, Iran in 1972. He received the BS and MS degrees both in Electrical Engineering from Sharif University of Technology, Tehran in 1994, and 1996 respectively. He received the Ph.D. degree in electrical engineering from the University of California, Los Angeles, in 1999. He is currently a Sr. Technical Director , and a Fellow, with Broadcom Corporation, Irvine, CA, within the RF group in Mobile and Wireless Business Unit. His interests include analog and RF IC design for wireless communications. Hooman holds over 200 issued or pending patents with Broadcom, and has published over 50 peer reviewed or conference papers. He is an IEEE distinguished lecturer.
	AMD (India)	Pankaj Singh, Chethan-Raj M , Prakash Raghavendra, Tony Tye, Dibyendu Das, Anindyasundar N, AMD India Pvt Ltd, Bangalore, India. Platform Coherency and SoC Verification Challenges. Abstract: Computing is going through sea of change today. From the days of single core computing to multi-cores, the computing industry is now moving to the era of “Heterogeneous computing”. Heterogeneous computing consists of varied class of processing elements from simple SIMD cores (in GPUs), DSP/FPGA compute units on the device side to complex multi-cores on the host side. Verification of such complex SoC's and Programming such disparate compute units easily and efficiently is always a challenge. AMD’s new SoC (Kaveri) is a heterogeneous system with an APU having Steamroller CPU cores and Sea Islands (CI) GPU. One of the important features of Kaveri is the support for coherent shared memory across CPU-GPUs. With this, programmers can access Shared Virtual Memory (SVM) that enables a pointer which is passed by the CPU to be accessed by the GPU without any explicit copy/transfer of data/buffer. The upcoming OpenCL 2.0 standard is based on C++11 standards for platform coherency and atomicity. The new SVM/atomics APIs defined in OpenCL 2.0 help programmers to share data between CPU and GPU easily and efficiently. Applications implementing concurrent lock-free data structures (accessible from both CPU and GPU) can exploit these APIs. We believe such applications will see significant performance/watt. The Kaveri APU supports new design features in the first HSA implementation such as Onion+ interface [hyper transport based bus interface] between Graphics core and North Bridge which is handled by a Coherent HUB (CHUB). It also supports new atomic operations natively by the Northbridge. The Onion+ bus along with the CHUB helps in GPU snooping the CPU caches for L2 accesses. AMD’s support for OpenCL 2.0 SVM/atomics APIs is via an LLVM based compiler for HSA. In this compiler, OpenCL 2.0 source is converted to HSAIL intermediate language (HSA Foundation Web URL). A finalizer component converts this HSAIL to target GPU ISA. The generated GPU ISA may need to invalidate/write-back L1/L2 GPU caches (software-managed caching) in order to support the coherency as defined by the OpenCL 2.0 standard. The SoC verification of HSA feature has been a challenge due to different test setup between CPU and GPU world. The essence of driver code in Open CL was translated into c-function call which was used by CPU using the compiler. One of the CPU thread acted as driver thereby configuring the GPU while other threads play the CPU side of coherency algorithm. Initial test development was done in advance before the availability of design by using Heterogeneous C- model system which instantiates CPU, GPU and common memory model .This approach minimized the overall test development effort. To identify interesting testing scenarios from a system-level end-use perspective inputs were gathered from Architecture and Software team. This presentation describes the platform level atomicity in detail and discusses HSA verification at SoC. The later part of this presentation also elaborates on some of the SoC verification challenges for complex heterogeneous system design with suggestions to improve on overall quality such as use of state machine based coverage driven stimulus to exercise corner case power management bugs and simplifying the H/W and S/W interaction to reduce the verification time. Acknowledgements: Authors would like to acknowledge the efforts of Narendra Kamat, Mark Fowler, Lee Howes, Roy Ju, Ben Sander (all from AMD) for their contributions. Bio: Pankaj completed his Bachelors in Electronics from NIT Bhopal in 1993; Master's in Electrical Engineering from USF, Florida and an MBA from SMU, Dallas. He has 19 years of industry experience which includes various leadership management roles such as IP Design center Manager with GDA Technologies, Full chip WIMAX SoC Design Manager with Texas Instruments, Design flow department head with Infineon Technologies. Currently he leading AMD’s next-gen IP interconnect group in Bangalore. He has published 18 technical papers in various international conferences on different design implementation-verification topics such as Synthesis, DFT, Analog IP integration and functional Verification. He has also been a board member of few conference committees.
	Breker Verification Systems	Thomas L. Anderson, Vice President, Marketing, Breker Verification Systems. The Search for a Truly Unified Verification Methodology. Abstract: The verification of complex semiconductor designs has emerged as one of the greatest barriers to product success. A veritable alphabet soup of “standard” methodologies has been proposed over the last 10 years, including eRM, RVM, AVM, URM, OVM and UVM (twice). They have made some progress in unifying certain aspects of the verification process, including standardized testbench architectures, verification reuse, and portability across different languages. However, none has proven to be a truly unified methodology, offering both vertical and horizontal reuse. Vertical reuse is the more commonly addressed aspect. Design engineers learned long ago that they could package up design intellectual property (IP) in the form of reusable blocks. These can be combined to build a larger block, a subsystem, or even a complete system-on-chip (SoC) for a fraction of the cost of designing from scratch. Verification reuse has lagged behind design reuse but is gaining traction, aided by the guidelines of the various standards. True vertical reuse spans from IP blocks all the way through multi-SoC systems. Since by definition some interfaces are absorbed into the combined design, it must be seamless to move from one level to the next. Further, it must be easy to reuse any passive verification components such as assertion checkers, protocol monitors, or scoreboards. Finally, it must be possible to develop a top-level model that understands and coordinates all traffic flowing and out of the full-chip interfaces. Horizontal reuse is more complex, spanning the entire timeline of the project. Verification begins with a high-level chip model, use primarily by the architecture team. Once this model has validated the overall SoC architecture and its target performance, the emphasis moves to the register-transfer-level (RTL) model running in simulation. The goal at this stage is to detect and eliminate as many hardware bugs as possible. The existing verification methodologies focus almost exclusively on testbenches for RTL simulation, although some can extend a bit earlier or later in the project. Some development teams have access to hardware acceleration that runs much faster than software simulation while supporting a similar testbench. RTL models can be mapped into hardware platforms that support both acceleration and in-circuit emulation (ICE). The key difference is that the notion of a testbench disappears during ICE, since the platform connects directly to the target environment (board and system) for the SoC. Similarly, the RTL code may be mapped into a FPGA-based rapid prototyping platform (RPP) that communicates with the target environment. During ICE and RPP, it is common for the development team to run production software (operating system and applications) to validate that the hardware-software combination works together. This may complete a circle with the virtual prototyping phase, during which the architects may have run early versions of the software. Finally, “first silicon” arrives from the foundry and is typically validated using some diagnostic code before being verified with production software in the final target system. A truly unified verification methodology must span the entire range or horizontal reuse as well as the more traditional vertical dimension. This talk surveys a wide range of verification approaches and assesses how well each meets the standard of unification. These approaches include: Testbench with hand-written directed tests Testbench using constrained-random stimulus generation Testbench using the Universal Verification Methodology (UVM) standard Formal analysis using assertions Graph-based generation of testbench transactions Hand-written C test cases running on embedded processors Graph-based generation of C test cases Hardware-software co-verification with production code Validation of first silicon with hand-written diagnostics Validation of first silicon with production code Results of this survey suggest a possible unified verification methodology that can span all aspects of both vertical and horizontal reuse, while leveraging existing testbench components and verification metrics. Bio: Thomas L. Anderson is Vice President, Marketing at Breker Verification Systems in Mountain View, CA. He previously served as Product Management Group Director for Advanced Verification Solutions at Cadence, Technical Marketing Director in the Verification Group at Synopsys and Vice President of Applications Engineering at 0-In Design Automation. Before moving into EDA he was Vice President of Engineering at IP pioneer Virtual Chips, following roles in ASIC design and management. Tom has presented more than 100 conference talks, published more than 150 papers and articles, and contributed to 12 books. He holds a BS in Computer Systems Engineering from the University of Massachusetts at Amherst and an MS in Electrical Engineering and Computer Science from the Massachusetts Institute of Technology (MIT).
	Panel (FREE for Everyone!)	“Technology & Entrepreneurship: Dreams, Realities & Opportunities” Open To Everyone
	Savant Company Inc. K5Launch SoC Conference UCI Knobbe Martens Olson & Bear LLP	Farhad Mafie, SoC Conference Chairman, IEEE OC SSCS & OCEN Chairs. Moderator Bio: Farhad Mafie is SoC Conference Chairman. He has over 20 years of experience in semiconductor and computer businesses and more than 10 years of university-level teaching experience. He is the former Vice President of Marketing and Engineering at Toshiba Semiconductor. He has also worked in strategic marketing, project and design engineering at Lucent Technologies, Unisys, and MSI Data. Farhad has a Master of Science and a Bachelor of Science degree in Electronic Engineering from California State University, Fullerton. He is an author and a translator, and his articles have been published in a variety of journals and Web-based magazines on technology and political affairs. In 2003, he published the biography of Iranian poet and Nobel nominee who lived in exile, Nader Naderpour (1929-2000), Iranian Poet, Thinker, Patriot. Farhad is also Editor-in-Chief for the CRC Press SoC Design and Technologies Book Series, which includes (1) Low-Power NoC for High-Performance SoC Design and (2) Design of Cost-Efficient Interconnect Processing Units. Farhad is an active member of IEEE, and he is the chair of IEEE Orange County Solid-State Circuits Society (SSCS), as well as IEEE Orange County Entrepreneurs' Network (OCEN). He is also a member of two UCI Advisory Committees: Communication System Engineering and Embedded System Engineering Certificate Programs. Panelists: 1. Charlie Baecker, Lecturer, Entrepreneurship and Strategy, Administrative Director, The Don Beall Center for Innovation and Entrepreneurship The Paul Merage School of Business. 2. Perry D. Oldham, Partner in the Orange County office of Knobbe Martens Olson & Bear LLP. 3. Dr. Goran Matijasevic is Senior Assistant Vice Chancellor, Alumni and Constituent Relations and the Executive Director of the Chief Executive Roundtable at the University of California, Irvine. 4. Ray Chan Managing Partner, K5Launch. 5. Richard W. Henson, Entrepreneur, Former CEO, Source Scientific, LLC. 6. TBD. This Panel Is Open To Everyone . . . Register for FREE Panel Pass More Updates Coming Soon . . . Several Opportunities to Win various Prizes During this Panel Discussion . . . Don't Miss Out!
	University of California, Irvine	Charlie Baecker, Lecturer, Entrepreneurship and Strategy, Administrative Director, The Don Beall Center for Innovation and Entrepreneurship The Paul Merage School of Business. Panelist Bio: or over 25 years Mr. Baecker has been involved with new technology-based ventures either as founder, key employee, investor or board member in both service and product-oriented companies. In 1987, he founded Assembly Technologies Corporation providing electronics contract manufacturing services to the Southern California aerospace, computer and medical device industries. In 1989 he sold the company and joined start-up Integrated Inference Machines, working on the development of high-performance symbolic computation engines designed for use in demanding defense, aerospace and communications applications. In 1992 he joined start-up Wonderware Corp. where he served as Director of Network Products Sales. As the Acting Director of the UCIdeas Research Commercialization Program, he is currently assisting a portfolio of UC Irvine technology companies pursue their commercialization plans.
	Knobbe Martens Olson & Bear LLP	Jarom Kesler, Partner in the Orange County office of Knobbe Martens Olson & Bear LLP. Panelist Bio: Jarom Kesler is a partner in the Knobbe Marten’s Orange County, California office. He provides guidance on strategic patent portfolio management, analysis of infringement and invalidity issues, due diligence, and intellectual property licensing matters. Mr. Kesler’s practice focuses on the medical device, information technology, and business method areas. He received a B.S. degree in E.E. from Brigham Young University and his J.D. from the University of Minnesota Law School.
	University of California, Irvine	Dr. Goran Matijasevic is Senior Assistant Vice Chancellor, Alumni and Constituent Relations and the Executive Director of the Chief Executive Roundtable at the University of California, Irvine. Panelist Bio: Goran Matijasevic is Senior Assistant Vice Chancellor, Alumni and Constituent Relations and the Executive Director of the Chief Executive Roundtable at the University of California, Irvine. In that capacity, he oversees and advances research collaborations and strategic initiatives associated with Alumni Association and Roundtable programs. He also serves as UC Irvine's ambassador to the local and national business community. Prior to this position, he was director of research development at The Henry Samueli School of Engineering at UC Irvine, as well as research coordinator of the Integrated Nanosystems Research Facility, where he worked on formation of new industry-university and academic collaborations, especially focusing on new interdisciplinary research initiatives. Prior to UCI, he worked as a senior engineer at QPlus, a telecommunications start-up company, and Director of Research at Ormet Technologies, a developer of electronic materials and technologies. He managed multiple SBIR projects that led to several industry consortia projects, as well as a license agreement with a Fortune 100 company. He has 4 U.S. patents, 3 book chapters, and over 40 conference and journal publications. Goran is currently on the OCTANe (Orange County Technology Action Network) Biomedical Industry Leadership Council, the board of Southern California Biomedical Council, and the advisory boards of 2-1-1 Orange County and TriTech SBDC, and the Economic Development Committee of the Orange County Business Council. He is the 2013 elected President of the University Industry Demonstration Partnership (UIDP), a national organization working under the auspices of the National Academies with the purpose of enhancing value of collaborative relationships between university and industry. Goran also serves on the UCI Calit2 Division Council, the UCI TechPortal Incubator Oversight Committee, and the MS in Engineering Management Steering Committee. He has volunteer taught the Entrepreneurship Course for Scientists and Engineers in the Henry Samueli School of Engineering for the last 7 years. Goran received his M.S. (’85) and Ph.D. (’91) degrees from UC Irvine in Electrical and Computer Engineering and his MBA (’03) from Pepperdine University.
	Source Scientific.	Richard W. Henson, Entrepreneur, Former CEO, Source Scientific, LLC. Panelist Bio: Richard Henson is the former CEO and one of the founders of Source Scientific, LLC, a medical instrument and device development firm in Irvine, California. Here, he and his partners developed original technology used in diagnostics. Today, Source Scientific develops and manufactures products for many well-known in-vitro diagnostic, ophthalmic, surgical and medical device companies. An experienced CEO with public company experience, Richard has worked with many high-tech firms in biomedical, consumer and critical power industries. He has a strong combination of technical, sales, marketing and managerial experience. He spent several years in Europe with Swiss-based manufacturers of critical power equipment for heavy industrial markets including nuclear, power generation, oil & gas, petrochemical and transportation. He has also served as President of Clary Corporation, a public company that manufactures harsh environment power systems for medical, military and transportation applications. Mr. Henson also serves on the CEO Roundtable at UC Irvine and the Octane Board of Directors. He is an alumnus of the Anderson School of Business at UCLA. He also attended California State University, Long Beach (CSULB). He has 4 children and lives in Laguna Beach, California.
	K5Launch	Ray Chan Managing Partner, K5Launch. Panelist Bio: As an active angel investor with a successful 25 year track record as a king/queen maker, Ray is committed to partnering with entrepreneurs to lead them to success. Working in tandem with these entrepreneurs, Ray loves sharing his passion and knowledge with the next class of game-changers. Ray has extensive experience within the tech startup industry. Ray is currently a member and Board Member of Tech Coast Angels and ACE Fund I and II Investment Committee. In 1985, he co-founded NetSoft, a leader in communications solutions between PCs, mainframes, and AS/400 systems. NetSoft was acquired by NetManage Inc. (NETM).
		Open To Everyone Reception & Networking
		11th International SoC Conference Closed.